Fabricating the Future
of Electronics

At TracXon we transform Hybrid Printed Electronics from a niche technology to a mainstream cradle-to-cradle manufacturing technology through continuous process and product innovation.

OUR OFFER

Hybrid Printed Electronics production experts
backed by
unique process IP

Go-to-market

High quality applications
for healthcare, automotive and consumer electronics.

Co-design

By a team of experts to design and develop products with new form factors, sizes and integration possibilities at manufacturing conditions.

Cost-efficiency

Fast and accurate production of high quality printed electronics products.

Process IP

HPE manufacturing using sheet-to-sheet (S2S) and roll-to-roll (R2R) printing and component assembly backed by strong process IP.

Sustainability

Circular manufacturing to reduce the environmental footprint of electronics contributing to the sustainability goals.

TNO Holst Centre Know-how

Spin-off from TNO Holst Centre, deploying the latest sustainable manufacturing techniques.

How TracXon Fabricates the Future of Electronics

Backed by

Meet the Leadership team
and collaborators

TracXon is backed by broad + deep expertise, strong IP and strategic collaboration with TNO

Ashok Sridhar, CEO
Ashok Sridhar,
CEO
Corne Rentrop, CTO
Corne Rentrop,
CTO
Corne Rentrop, CTO
Michiel Plaisier,
CFO
Raghu Pendalays COO
Raghu Pendyala, COO
Paul Breddels Senior Advisor
Paul Breddels,
Advisor
TracXon team

Lighting

Led-on-foil with fine resolution circuitry for decorative illumination.

Automotive

Led-on-foil for large-area illumination.

Healthcare

Flexible strain sensor for healthcare application.

Electronics

Large area temperature sensors for battery systems.
CURRENT PROJECTS

Projects

TracXon specializes in the manufacturing of Hybrid Printed Electronics using sheet-to-sheet (S2S) and roll-to-roll (R2R) printing and component assembly.

We are a value chain partner to co-design, prototype, pilot manufacture and go all the way to mass production.

State-of-the-art
equipment and technology

Equipment

• Flat-bed screen printing
• Roll-to-roll screen printing
• Photonic sintering
• Stencil printing
• SMD assembly
• Roll-to-roll SMD assembly
• Underfill / glob top dispensing
• High pressure forming
• Lamination
• Reflow and curing ovens

Functional materials for printed electronics

materials

• Conductive ink
• Dielectric ink
• Resistive ink
• Piezoelectric ink
• Interconnect materials
  (conductive adhesive, solder paste)
• Underfill
• Glob top
• Electrochromic ink
• Electroluminescent ink
• Any screen printable ink formulation